Power semiconductor substrate (DCB)
Over 10 years of manufacturing experience for substrates for thermoelectric modules (Peltier elements). For power devices, solid-state relays (SSR), and more!
This is an insulating substrate for heat dissipation, which has a copper circuit board bonded to an alumina ceramic substrate using the DCB (Direct Copper Bond) method. *DCB (Direct Copper Bond) method refers to the technique of bonding a copper circuit board to a ceramic substrate through eutectic reaction. **Features** - Over 10 years of manufacturing experience for substrates used in thermoelectric modules (Peltier elements). - Manufactured at a 100% wholly-owned subsidiary in China. - Options for alumina ceramic white boards from Japan, Germany, or China. - The ceramic substrate can flexibly accommodate various external dimensions through mold processing, laser processing, etc. - The ceramic white board and copper plate are bonded using in-house equipment, and copper plating processes such as etching are applied before shipment. - The surface of the copper circuit can be treated in various ways, including untreated, Ni plating, and Ni + Au plating. *For more details, please contact us or download the PDF.*
- Company：フェローテックホールディングス
- Price：Other
![[Analysis Case] Measurement of Impurity Concentration on the Surface and Inside of SiC Substrates](https://image.mono.ipros.com/public/product/image/b28/2000999624/IPROS35315001111634549606.jpeg?w=280&h=280)
